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HSOP是什么封装,英文全称是什么,谢谢

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HSOP是什么封装,英文全称是什么,谢谢
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答案和解析
Heatsink  Small Out-Line Package (带散热片的小尺寸封装)
HSOP is a surface mount package with ìgull wingî lead form.This package has
a mechanically attached thick Copper (Cu) heat slug to improve the thermal performance.The
exposed heat slug provides a direct path for heat conduction awayfrom an IC and into a solder
attached Printed Circuit Board (PCB).